Bond issue plan cools markets

Stock Markets

Thursday, August 28, 2008 19:57:19

	Bond issue plan cools markets By STAFF EDITOR Published: June 29, 2007 03:03 PM The benchmark Shanghai Composite Index lost 4.03% Thursday to close at 3,914 points after the government announced plans to issue US$200 billion (RMB1.55 trillion) worth of bonds, the Shanghai Securities News reported. It was the steepest ... You are currently reading 35 words of 109 total words in this article. To continue reading this article, you must be a subscriber. Log in now. Buy this article now for $10 USD. Not a subscriber? Start your 7-day free trial now. bookmark \| digg \| Permalink \| Tell a Friend Tags for this article: finance , investment , stock market , US , foreign exchange , Shenzhen	More Articles in Stock Markets > Today’s Daily Briefs E-Mail Sign up for a roundup of the day’s top stories, sent every day. RELATED ARTICLES > State-owned assets set to flood mainland stock market Ping An triggers stock slide China Merchants Property wins approval for US$1.17b share issue Hunan Publishing to list units Citic Securities’ 1H profit down 5.65% to US$96m Mainland firms raise US$7b in 56 Q2 IPOs Zhejiang businessman draining capital from financial markets

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