Qualcomm Inc. said on Thursday it was partnering with China's Semiconductor Manufacturing International Corp. to fabricate and test 3G wireless cell-phone chips , EETimes reported.   Chinese foundry provider SMIC (Shanghai) will make Qualcomm's chips based on a specialized BiCMOS process technology at its 200-mm fab in Tianjin.The two companies dropped hints that the deal revolves around cellular-phone chips and power management ICs, said the paper.   Qualcomm said the partnership would help it deliver chips to customers faster and improve manufacturing cost-effectiveness. Qualcomm, a CDMA wireless hardware and software developer, has planned to invest 100 million US dollars in early-to mid-stage Chinese companies focused on CDMA technology.