ASAT Holdings Limited, through its subsidiaries, provides semiconductor package design, assembly, and test services to customers in the semiconductor industry. It offers assembly services for various semiconductor packages, including chipscale, such as fine pitch ball grid array (BGA), leadless plastic chip carrier, and thin array plastic packaging; and nonchipscale packages, which include plastic BGA, tape BGA, and flip chip packages. The company provides semiconductor test services for digital logic, analog, and mixed signal products, as well as for RF semiconductors, including semiconductors in cell phones, wireless applications, such as Bluetooth, and wireless LAN products. ASAT sells its assembly and test services through a network of international offices in the United States, Hong Kong, Singapore, Germany, and South Korea. The company was founded in 1999 and is headquartered in Tsuen Wan, Hong Kong.

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